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Embedded Module TQMx70EB

with Intel® Core™ i3/i5/i7 7000E (Gen. 7)

COM Express® Basic Modul (Type 6)

  • Intel® Core™ 7000E series / Intel® Xeon® E3-15xx v6 series ("Kaby Lake-H") with up to Quad-Core 3.7 GHz / 8 MB cache
  • Impressive graphics performance (Intel® Iris™ Pro 630)with hardwarebased 10-bit HEVC and VP9 en-/decoding
  • Intel® Optane™ 3D XPoint SSD support
  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC
  • High bandwidth with up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)
  • TQMx86 board controller with flexible customization options (flexiCFG)
  • Mobile Intel® 100 series chipset (CM238)
  • TPM 1.2 / 2.0
  • “Green ECO-Off” (minimum of standby power)
  • Watchdog und thermal management
  • Highest reliability, 24/7 certified
  • Quality Made-in-Germany

  • Base

    Information

    The TQ module TQMx70EB is designed for high end computing and graphics capabilities. With Dual-Channel DDR4-2133 support, high bandwidth PCIe, 4x SATA (6 Gb/s) and 4x USB 3.0 the TQMx70EB guarantees best in class system performance. The module can be equipped with 7th Generation Intel® Core™ i7/i5/i3 and Intel® Xeon® E3-15xx v6 processors (Codename Kaby Lake-H). The integrated Intel® GT2 graphics controller supports up to three independent display outputs with up to 4K resolution @ 60 Hz and excellent 3D / rendering performance. 10 bit graphics encoding/decoding deliver high color fidelity premium content. Latest power and performance optimizing functions like Intel® Turbo Boost Technology 2.0 and Enhanced Intel® SpeedStep Technology enable perfect user experience with moderate power consumption. This high end COM Express® Basic Type 6 module is best suited for high demand medical, gaming and industrial applications.

  • Detail

    specification

    Memory

    EEPROM:

    32 kBit (24LC32)

    Memory:

    DDR4-2133: up to 32 GB, w.ECC Option, 2 SO-DIMMs

    System interfaces

    Serial interfaces:

    2x Serial Port (Rx/Tx, Legacy compatible, 4-lanes optional with TQ flexiCFG)

    Gigabit Ethernet:

    1x Gigabit Ethernet (Intel® i219-LM)

    SATA:

    4x SATA Gen3 (up to 6Gb/s)

    I²C:

    1x I²C, (2nd I²C optional) (master/slave capable)

    SPI:

    1x SPI (for external uEFI BIOS Flash)

    USB:

    4x USB 3.0 (with USB 2.0 backward compatibility)|8x USB 2.0 (inkl. USB 3.0 Ports)

    Security Components

    TPM:

    SLB9660 TPM 1.2, alternatively SLB9665 TPM 2.0

    General

    Board-Controller:

    TQMx86 board controller with watchdog and TQ flexiCFG

    RTC:

    Industrial real time clock (iRTC)|(highly accurate, temperature compensated, minimum input current)

    Supervisor:

    Hardware monitor for thermal management

    Power supply:

    8,5 V - 20 V | 5 V Standby (optional) | 3 V Batterie / GoldCAP (optional)

    Power:

    typ. 25-30 W / max. 60 W | (Green ECO-Off: < 0,1W)

    Temperature range:

    0°C ... +60°C

    Dimensions:

    COM Express® Basic, Type 6, PICMG COM.0 R2.1|125 mm x 95 mm

    Microprocessor

    CPU:

    Intel® Core™ 7000E series| Core i7-7820EQ (4x 3.0 / 3.7 GHz, 8 MB, 45/35W)| Core i5-7440EQ (4x 2.9 / 3.6 GHz, 6 MB, 45/35W)| Core i5-7442EQ (4x 2.1 / 2.9 GHz, 6 MB, 25W)| Core i3-7100E (2x 2.9, 3 MB, 35W)| Core i3-7102E (2x 2.1 GHz, 3 MB, 25W)

    CPU frequency:

    Intel® Xeon® E3-1500 v6 series| Xeon E3-1505M v6 (4x 3.0 / 4.0 GHz, 8 MB, GT2, 45 / 35W)| Xeon E3-1505L v6 (4x 2.2 / 3.0 GHz, 8 MB, 25 W)

    Graphics

    Graphic interfaces:

    Three independent display outputs:|3x Digital Display Interface / DP++ with up to 4K@60Hz|LVDS Interface (18/24 bit, Single/Dual Channel), up to 4K|(optional eDP 1.4 instead of LVDS)|Intel® Quick Sync Video + Wireless Display

    Electrical Connections

    Power supply:

    8,5 V - 20 V | 5 V Standby (optional) | 3 V Batterie / GoldCAP (optional)

    Other interfaces & busses

    Audio Interface:

    1x Intel® HD Audio (HDA)

    PCIe:

    8x PCIe Gen 3 (4x1 or 1x4)|1x PEG Port (PCIe x16)

    LPC:

    1x LPC bus

    SMBus:

    1x SMBus

    GPIO:

    8x GPIO

  • Downloads

    for Embedded Module TQMx70EB

  • Ordering

    Information

    TQMx70EB-AB (Mainstream)
    Core i5-7442EQ (4x 2.1 / 2.9 GHz, 6M, 25W),CM238, LVDS, Standard Temp 0..+60°C

    TQMx70EB-AC (Entry Level)
    Core i3-7102E (2x 2.1 GHz, 3MB, 25 W), CM238, LVDS, Standard Temp 0..+60°C

    TQMxE70EB-AD (Extreme)
    Xeon E3-1505L v6 (4x 2.2 GHz / 3.0 GHz, 8M, 25 W), CM238, LVDS, Standard Temp 0..+60°C

    TQMx70EB

    Other configurations on request

    • CPU
    • TPM
    • LVDS/eDP
    • Extended temperature range (screening)
    • Custom specific BIOS
    • Conformal coating / Protection against high humidity

    Starterkit STKX70EB-INDIVIDUELL

     

Support

Our Field Application Engineers offer support during all phases of a project, from consulting and design-in to after-sales assistance. Current data sheets and product catalogs can be found in our Download Center.

__Support-Wiki

__Umfangreiche Informationen aus dem Softwarebereich wie Beispielcodes, Tipps und Tricks, Anwendungshinweise, FAQs sowie Bsp.-Dokumentationen stehen Ihnen in unserem Support Wiki zur Verfügung.

Mit TQ zum Erfolg

Von der Idee bis zur Serienreife entwickelt und produziert TQ elektronische Leiterplatten, Baugruppen und Geräte nach kundenspezifischen Anforderungen (E²MS). Das Dienstleistungsspektrum reicht von Anwendungen im Bereich der Industrieelektronik über Medizintechnik, Automatisierungstechnik und Messtechnik bis hin zur Verkehrs- und Transporttechnik.

  • Langjährige Erfahrung und Know-How
  • Qualifiziertes Support-Team
  • Obsolescence Management
  • Partnerschaftliche Zusammenarbeit
  • Termintreue und Liefersicherheit
  • Qualitätskontrolle durch Zertifizierungen